- AEC - Q101 Rev - D1: Failure Mechanism Based Stress Test Qualification For Discrete Semiconductors (base document)
- AEC - Q101-001 - Rev-A: Human Body Model (HBM) Electrostatic Discharge Test
- [Decommissioned] AEC - Q101-002 - Rev-A: Machine Model (MM) Electrostatic Discharge Test
- AEC - Q101-003 - Rev-A: Wire Bond Shear Test
- AEC - Q101-004 - Rev-: Miscellaneous Test Methods
- AEC - Q101-005 - Rev-: Charged Device Model (CDM) Electrostatic Discharge Test
- AEC - Q101-006 - Rev-: Short Circuit Reliability Characterization of Smart Power Devices for 12V Systems
- AEC - Q200 Rev - D base: Stress Test Qualification For Passive Components (base document)
- AEC - Q200-001 - Rev-B: Flame Retardance Test
- AEC - Q200-002 - Rev-B: Human Body Model (HBM) Electrostatic Discharge Test
- AEC - Q200-003 - Rev-B: Beam Load (Break Strength) Test
- AEC - Q200-004 - Rev-A: Measurement Procedures for Resettable Fuses
- AEC - Q200-005 - Rev-A: Board Flex / Terminal Bond Strength Test